Protective tape for formed circuit on wafer surface during the back grinding process of the semi-conductor manufacturing process
ICROS™ TAPE
High-clean adhesive tape
Applications detail
Applications
Characteristics
Please visit https://www.mcictm.com/icros/ to get more information about this product.
- Basic information
ICROS™ Tape has been the world top BG (Back grinding) tape for many decades. Now, our tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow. Please refer to each tape explanation for more details.
Main features of ICROS™ Tape
- Extremely low contaminated Tape (both UV and Non-UV)
- Superior total thickness type
- High adhesion and easy peel
- High heat resistance & chemical resistant tape
- Bump absorption of the wafer in the process
- Custom made possible
Contact Us
MITSUI CHEMICALS INDIA, PVT. LTD.
TEL
+91-9650077207
FAX
+91-11-41204299